Chuang Wei Electronic Equipment Manufactory
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Hotbar Bonding Machine (CWPC-1A)

Model Number: CWPC-1A
Country of Origin: china
Export Markets:
  • North America
  • South America
  • Eastern Europe
  • Southeast Asia
  • Africa
  • Oceania
  • Mid East
  • Eastern Asia
  • Western Europe
Minimum Order: 1
Price/Payment: T/T
Hotbar Bonding Machine

Product Specifications/Features

    Size: 620mm X 690mm X 570mm
    Max. Working Area: 200mm X 260mm
    Air Pressing: 0.45-0.7Mpa
    Weight: 95Kg
    Feature:
    1.       Extremely short cycle time with rotary table design. Product loading and
    unloading can be done during the heat sealing process
    2.         High quality heat seal application up to 0.25mm pitch
    3.         Pneumatic bonding head provide up to 3,900N force
    4.         Digital programmable pressure control with LCD display
    5.         Closed loop PID temperature control with visible LED display
    6.         Bonding cycle is triggered by a real time pressure sensor
    7.         Floating Thermode ensure consistent pressure and heat transfer
    along the flexfoil to LCD and/or PCB
    8.         Precision product fixtures (2X), easy exchange, provided with micrometer
    alignment and vacuum to fix components
    9.         Optional CCD alignment module with frame, camera, lens, monitor and
    illumination for fine pitch application
    10.     Full microprocessor logic control

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