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dB-8002 Fully Automatic LED Die BonderdB-8002 Fully Automatic LED Die Bonder 2011-01-16
MAIN FEATURES Wafer stage: Linear guide way and Ball screw, high positioning precision and repeatability. ※ Effectual travel: 152×152mm ※ Repeatab ... more
MAIN FEATURES Wafer stage: Linear guide way and Ball screw, high positioning precision and repeatability. ※ Effectual travel: 152×152mm ※ Repeatab ... more
China (Mainland)
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